High heat-resistant, low-loss flexible substrate for wearables
A flexible substrate that achieves both miniaturization and high performance without the use of adhesives.
As wearable devices continue to shrink in size, the enhancement of circuit board performance is essential. In particular, high-density implementation in limited space and high reliability are required. It is also important to accommodate high-temperature environments and high-frequency signals. Our high heat-resistant, low-loss all-LCP flexible circuit boards meet these challenges. 【Usage Scenarios】 - Smartwatches - VR/AR devices - Healthcare devices - Wearable sensors 【Benefits of Implementation】 - Compatibility of miniaturization and high performance - High reliability - Improvement of high-frequency characteristics
- Company:山下マテリアル
- Price:Other